Method of manufacturing silicon carbide self-aligned epitaxial mosfet for high powered device applications

ABSTRACT

A self-aligned, silicon carbide power metal oxide semiconductor field effect transistor includes a trench formed in a first layer, with a base region and then a source region epitaxially regrown within the trench. A window is formed through the source region and into the base region within a middle area of the trench. A source contact is formed within the window in contact with a base and source regions. The gate oxide layer is formed on the source and base regions at a peripheral area of the trench and on a surface of the first layer. A gate electrode is formed on the gate oxide layer above the base region at the peripheral area of the trench, and a drain electrode is formed over a second surface of the first layer.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional application of application Ser. No.11/711,703 filed on Feb. 28, 2007, which is hereby incorporated for allpurposes.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a silicon carbide self-aligned MOSFET(metal oxide semiconductor field effect transistor) having epitaxialre-grown layers for use in high powered device applications, and amethod of manufacturing a silicon carbide self-aligned MOSFET havingepitaxially re-grown layers.

2. Description of the Background Art

Silicon carbide (SiC) power MOSFETS are frequently made using adouble-implanted MOSFET process (DIMOS), wherein implantation is used tocreate both the p-type base region and the n-type source region. Anissue of concern is that the use of implantation damages the SiC. Thequality of any oxide subsequently formed from the damaged SiC is poor.The reliability of SiC power MOSFETS is determined by how well the gateoxide is protected from the high voltage that the component mustcontrol.

SUMMARY OF THE INVENTION

In accordance with a first embodiment, a MOSFET is provided including incombination a first layer having opposite first and second surfaces anda trench extending from the first surface into the first layer, thefirst layer having a first conductivity type; a first epitaxial layerwithin the trench on sidewalls and a bottom of the trench, the firstepitaxial layer having a second conductivity type opposite the firstconductivity type; a second epitaxial layer within the trench on thefirst epitaxial layer, the second epitaxial layer having the firstconductivity type; oxide spacers above the trench on the secondepitaxial layer; a source contact within the trench between the oxidespacers and in contact with the first and second epitaxial layers; agate oxide layer on the first surface of the first layer and on asurface of the first epitaxial layer above the trench that is notbetween the oxide spacers; a gate electrode on the oxide layer over thesurface of the first epitaxial layer; and a drain electrode over thesecond surface of the first layer.

In accordance with a further embodiment, a method of manufacturing aMOSFET includes in combination forming a trench in a first layer, thefirst layer having opposite first and second surfaces, the trenchextending into the first layer from the first surface; epitaxiallygrowing a second layer and then a third layer within the trench and overthe first surface of the first layer; etching the first and secondlayers using a mask to expose the first surface, to remove the thirdlayer and part of the second layer within a middle area of the trench,and to expose a surface of the second layer in a peripheral area of thetrench, to provide a first structure; forming a gate oxide layer on anentirety of the first structure; forming a gate electrode on the gateoxide layer over the surface of the second layer; etching the gate oxidelayer within the middle area of the trench; forming a source electrodewithin the middle area of the trench in contact with the second andthird layers; and forming a drain electrode over the second surface ofthe first layer, wherein the first and third layers have a conductivitytype opposite a conductivity type of the second layer.

In accordance with a still further embodiment, a method of manufacturinga MOSFET is provided including in combination forming a trench in afirst layer, the first layer having a first conductivity type andopposite first and second surfaces, the trench extending into the firstlayer from the first surface; epitaxially growing a second layer withinthe trench and on the first surface of the first layer, the second layerhaving a second conductivity type opposite the first conductivity type;epitaxially growing a third layer on the second layer within the trenchand over the first surface of the first layer, the third layer havingthe first conductivity type; forming a first oxide layer on the thirdlayer within the trench and over the first surface of the first layer;etching the first oxide layer substantially vertically so that the firstoxide layer remains only over the trench as oxide spacers and so thatthe third layer is exposed between the oxide spacers, to provide a firststructure; etching the first structure using the oxide spacers as a maskto expose the first surface, to remove the third layer and part of thesecond layer between the oxide spacers, and to expose a surface of thesecond layer within the trench that is not between the oxide spacers, toprovide a second structure; forming a gate oxide layer on an entirety ofthe second structure; forming a gate electrode on the gate oxide layerover the surface of the second layer; etching the gate oxide layerbetween the oxide spacers; forming a source electrode between the oxidespacers in contact with the second and third layers; and forming a drainelectrode over the second surface of the first layer.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other objects and features of the present invention willbecome apparent from the following description of the preferredembodiments made in connection with the accompanying drawings, in which:

FIG. 1 illustrates a cross-section of the structure after etching atrench and implanting an optional impurity region;

FIG. 2 illustrates a cross-section of the structure after epitaxialregrowth of a base region and a source region;

FIG. 3 illustrates a cross-section of the structure after formation ofan oxide layer;

FIG. 4 illustrates a cross-section of the structure after etching theoxide layer to form oxide spacers within the trench;

FIG. 5 illustrates a cross-section of the structure after planarizationand etching using the oxide spacers as a mask;

FIG. 6 illustrates a cross-section of the structure after formation of agate oxide layer;

FIG. 7 illustrates a cross-section of the structure after etching theoxide spacer and subsequent gate oxide regrowth;

FIG. 8 illustrates a cross-section of the structure after formation of agate electrode;

FIG. 9 illustrates a cross-section of the structure after etching withinthe trench to provide an opening for a source contact; and

FIG. 10 illustrates a cross-section of the power MOSFET after formationof source and drain electrodes.

DETAILED DESCRIPTION

The present invention will now be described more fully with reference tothe accompanying drawings, in which preferred embodiments of theinvention are shown. This invention may however be embodied in manydifferent forms and should not be construed as limited to theembodiments set forth. Rather, the embodiments as described are providedso that this disclosure will be thorough and complete, and will fullyconvey the concept of the invention to those skilled in the art. In thedrawings, the shape and thickness of the elements may be exaggerated forclarity, and are not necessarily drawn to scale. Also, like referencenumbers are used to refer to like elements throughout the application.Description of well known methods and materials are omitted.

A method of manufacturing a self-aligned silicon carbide (SiC) powerMOSFET (metal oxide semiconductor field effect transistor) of anembodiment is described beginning with reference to FIG. 1, which showslayer 10 having a top surface 12 and an opposite bottom surface 11. Inthis embodiment, layer 10 has n-type conductivity. Layer 10 may becharacterized as a drift layer, and is shown as disposed on layer 15which may be characterized as the substrate including any eventualbuffer layer. Layer 10 has a thickness determined by the voltage to becontrolled by the MOSFET, whereby the thickness is typically in therange of about 5 to 150 micrometers. Layer 10 has a dopant concentrationin a range of about 1×10¹⁴ cm⁻³ to 5×10¹⁶ cm⁻³. Layer 15 may becharacterized as including a substrate having thickness in the range ofabout 200 to 500 micrometers and a buffer layer having thickness in arange of about 0.5 to 2 micrometers. A concentration of layer 15 may bein a range of about 10×10¹⁴ cm⁻³ to 1×10²⁰ cm⁻³. Layers 10 and 15 may beepitaxially grown during the same process, or separately, using metalorganic chemical vapor deposition (MOCVD). Nitrogen or phosphorous maybe used as n-type dopants.

A mask 17 is shown in FIG. 1 as patterned on top surface 12 of layer 10.Mask 17 may be a resist layer formed and patterned using standardphotolithographic techniques, as would be understood by one of ordinaryskill. The structure is subsequently etched using a dry etchingtechnique (such as Reactive Ion Etching) to form trench 18 having abottom surface 13 and sidewalls 16. Trench 18 may have a depth in arange of about 0.5 to 2.5 micrometers and a width in the horizontal orx-direction of FIG. 1 of at least 0.5 micrometers. In an optionalprocess procedure, p⁺-type impurity region 14 may be ion-implanted intobottom 13 of trench 18 through mask 17. Aluminum or boron may be used asa p-type dopant, and the dopant concentration of impurity region 14 maybe in a range of about 5×10¹⁸ cm⁻³ to 1×10²⁰ cm⁻³. The purpose ofimpurity region 14 will be described subsequently. It should beunderstood however that the MOSFET device as subsequently described isoperational even without impurity region 14.

In a following process as described with reference to FIG. 2, afterremoval of mask 17 shown in FIG. 1, a p-type silicon carbide layer 20 isepitaxially regrown within trench 18 on bottom 13 and on sidewalls 16 oftrench 18, and also on top surface 12 of layer 10. Layer 20 covers thestructure as illustrated in its entirety. Since the crystal planes ofsilicon carbide layer 10 along bottom surface 13 and sidewalls 16 oftrench 18 are not the same, epitaxial regrowth of silicon carbide withintrench 18 is not uniform. That is, epitaxial regrowth in the horizontaldirection (the x-direction as shown in FIG. 1) is typicallysignificantly greater than epitaxial regrowth in the vertical direction(the y-direction as shown in FIG. 1) when using the Si-face of the SiCwafer. For example, the rate of epitaxial regrowth of silicon carbide inthe horizontal direction can be about 3 times greater than the rate ofepitaxial regrowth of silicon carbide in the vertical direction. Incontrast, dopant incorporation of impurities is much greater duringexpitaxial regrowth of silicon carbide in the vertical direction thanduring epitaxial regrowth of silicon carbide in the horizontaldirection. For example, the rate of dopant incorporation duringepitaxial regrowth of silicon carbide in the vertical direction can beabout 10 times greater than the rate of dopant incorporation duringepitaxial regrowth of silicon carbide in the horizontal direction. Thedopant concentration of layer 20 is dependent on whether or not impurityregion 14 as described with respect to FIG. 1 is implanted in layer 10.In the case that impurity region 14 is implanted, the dopantconcentration of layer 20 would be about 1×10¹⁷ cm⁻³, with dopantconcentration of the side walls being correspondingly less. In the casethat impurity region 14 is not implanted, the dopant concentration asnoted above would be about 10 times greater. Also, as a result of thisanisotropy in growth rate, epitaxially regrown silicon carbide layer 20may have a thickness in a range of about 0.2 micrometers at bottomsurface 13 of trench 18 and on top surface 12 of layer 10 for example.In contrast, the thickness of epitaxially regrown silicon carbide layer20 on sidewalls 16 of trench 18 may be in a range of about 0.5micrometers for example. The p-type silicon carbide layer 20 withintrench 18 will serve as a p-type base region of the MOSFET device.

With further reference to FIG. 2, an n-type silicon carbide layer 30 issubsequently epitaxially regrown on p-type silicon carbide layer 20.Epitaxially regrown silicon carbide layer 30 is shown as entirelycovering the surface of the structure as illustrated, as particularly onp-type silicon carbide layer 20 over bottom 13 and sidewalls 16 oftrench 18, and as on p-type silicon carbide layer 20 over top surface 12of layer 10. Epitaxially regrown silicon carbide layer 30 may have athickness in a range of about 0.5 micrometers and a dopant concentrationin a range of about

5×10¹⁹ cm⁻³. As should be understood by one of ordinary skill, the uppersurface of the structure as shown in FIG. 2 is step-like, including anindentation or depression above trench 18. The n-type silicon carbidelayer 30 within trench 18 will serve as an n⁺-type source region of theMOSFET device.

In a following process as described with respect to FIG. 3, a lowtemperature oxide (LTO) layer 40 is grown on n-type silicon carbidelayer 30 over the entirety of the structure as illustrated, in a manneras would be understood by one of ordinary skill. For instance, oxidelayer 40 may have a thickness in a range of about 1 micrometer, and isshown as having step-like coverage with an indentation above the trench.Oxide layer 40 may be silicon dioxide.

In a following process as described with respect to FIG. 4, thestructure of FIG. 3 is etched using a reactive ion etching (RIE) plasmatechnique. This particular etching is highly anisotropic andpredominantly in the vertical or y-direction shown in FIG. 1, withlittle or no etching in the horizontal or x-direction. As a result,oxide layer 40 is removed to expose top surface 32 of n-type siliconcarbide layer 30. Oxide layer 40 is also etched back within thestep-like indentation above the trench to form oxide spacers 42 nearsidewalls of the trench, whereby window 44 between oxide spacers 42exposes surface 34 of n-type silicon carbide layer 30 at a middle areaof the trench.

In a following process as described with reference to FIG. 5, an etchingprocess is carried out on the structure shown in FIG. 4 to removeportions of p-type silicon carbide layer 20 and n-type silicon carbidelayer 30. This etching process may be characterized as includingplanarization and over-etching, using oxide spacers 42 as a mask.Epitaxially regrown n-type silicon carbide layer 30 and p-type siliconlayer 20 are planarized to expose top surface 12 of layer 10. The p-typesilicon carbide layer 20 and n-type silicon carbide layer 30 are alsoplanarized above a peripheral area of the trench near sidewall 16 of thetrench. The p-type silicon carbide layer remaining within the trenchsubsequent this etching constitutes a p-type base region 22 of theMOSFET, and includes a top surface 24 at a peripheral area of the trenchthat is substantially coplanar with top surface 12 of layer 10, as shownin FIG. 5. Also, the n-type silicon carbide layer remaining within thetrench constitutes an n⁺-type source region 36 of the MOSFET, andincludes an upper surface 38 substantially coplanar with top surface 12of layer 10 and top surface 24 of base region 22. Source region 36 alsoincludes a region that extends upwardly above upper surface 38, whichregion is protected from over-etching by oxide spacer 42. Also, portionsof p-type silicon carbide layer 20 and n-type silicon carbide layer 30within the middle area of the trench are over-etched using oxide spacers42. A window 46 is thus formed in the middle area of the trench, wherebywindow 46 extends entirely through source region 36 and partly throughbase region 22, exposing sidewall surfaces of source region 36 as wellas bottom and sidewalls surfaces of base region 22.

In a following process as described with reference to FIG. 6, an LTOprocess is then carried out to from a thin gate oxide layer 50 over theentirety of the structure shown in FIG. 5. Gate oxide layer 50 may besilicon dioxide, and may have a thickness in a range of about 10 to 50nm. As shown, gate oxide layer 50 is formed on top surface 12 of layer10, top surface 24 of base region 22, upper surface 38 of source region36, over oxide spacer 42 and within window 46.

In a following process as described with reference to FIG. 7, thethickness of gate oxide layer 50 is increased in certain areas.Particularly, the thickness of gate oxide layer 50 is increased at theexposed sidewall surfaces within window 46 and on the sidewall surfacesof oxide spacer 42, including the upwardly extending sidewall surface ofsource region 36. The thickened gate oxide layers are indicated byreference numeral 52 in FIG. 7. In this two step process, an RIE processthat is highly anisotropic predominantly in the vertical direction isfirst carried out on the structure shown in FIG. 6. Gate oxide layer 50disposed on surfaces that extend horizontally along the x-direction arethus removed. However, portions of gate oxide layer 50 on surfaces thatextend nearly vertical along the y-direction are substantially notetched. Thereafter, another LTO growth process is carried out, wherebyoxide having desired thickness is laid down on surfaces that extendhorizontally along the x-direction. This laid down oxide is indicated byreference numeral 50 in FIG. 7. This LTO growth process also putsadditional oxide on the oxide that remained after the RIE process, thatis the oxide on surfaces that extend nearly vertically along they-direction. As a result, the oxide on the nearly vertically extendingsurfaces thus have a somewhat thicker composite oxide thereon, asindicated by reference numeral 52 in FIG. 7. This production techniqueinvolving increasing oxide layer thickness as described with respect toFIG. 7 is optional. That is, the MOSFET device would function withoutthe above described oxide thickening. An advantage of this productiontechnique is that the thicker gate oxide layers 52 help to reducecapacitance between the subsequently formed gate and source electrodesof the MOSFET.

In a following process as described with respect to FIG. 8, gateelectrode 60 is formed on oxide layer 50 over top surface 12 of layer 10and top surface 24 of base region 22. Gate electrode 60 extends onto thestep-like portion of gate oxide layer 50 over oxide spacer 42. Gateelectrode 60 may be polycrystalline silicon deposited using an LPCVD(low pressure chemical vapor deposition) technique. In the alternative,gate electrode 60 may be a metal such as molybdenum or aluminum, amongother suitable metals. Such metal electrodes would typically bedeposited by a sputtering or evaporation technique. Not shown in FIG. 8is a mask used during formation of gate electrode 60, such mask beingformed and patterned using standard photolithographic techniques aswould be understood by one of ordinary skill.

In a following process as described with respect to FIG. 9, oxide layer50 and portions of oxide spacers 42 in a middle area above the trenchare etched away in preparation of source contact metallization. Althoughnot shown, a resist formed by standard photolithographic techniques isfirst formed on the structure shown in FIG. 8. The resist covers gateelectrode 60 and peripheral portions of oxide spacers 42 nearer tosidewall 16 of the trench. Oxide layer 50 above portions of oxidespacers 42 near the middle area of the trench and oxide layers 50 and 52within window 46 remain exposed through the unillustrated resist. Atwo-step etching process is subsequently carried out including an RIEprocess which removes the majority of oxide layers 50 and 52 and oxidespacers 42 exposed through the resist and a chemical wet etching issubsequently carried out which removes oxide remaining after the initialRIE process. As a result of this two-step etching process, a top surface39 of source region 36 is exposed within the middle area of the trenchbetween oxide spacers 42, sidewall surfaces of source region 36 areexposed within window 46, and bottom and sidewall surfaces of baseregion 22 are exposed within window 46.

The etching process as described in connection with FIG. 9 should not belimited merely as a two-step process including an RIE process followedby chemical wet etching. That is, the order of etching may be reversed,or in the alternative a single etching process may be carried out toremove oxide layer 50 within the middle area of the trench. However,etching during an RIE process is predominantly anisotropic in thevertical direction. This helps to maintain oxide spacers 42 wider in thehorizontal or x-direction, with minimal undercutting of oxide spacers 42below the resist mask.

In a following process as described with respect to FIG. 10, sourcecontact 70 is formed within the middle portion of the trench betweenoxide spacers 42, on top surface 39 of source region 36, on sidewallsurfaces of source region 36 exposed within window 46, and on bottom andsidewall surfaces of base region 22 within window 46. Source contact 70is an ohmic contact self-aligned between oxide spacers 42. Typicalmetals for ohmic source contact 70 include nickel, titanium andtitanium-tungsten, among other possibilities. Source contact 70 may beformed by a sputtering or evaporation technique. Drain electrode 80 issubsequently formed on surface 19 of layer 15, whereby drain electrode80 may also be a metal such as nickel, titanium and titanium-tungsten,among other possibilities. The thus completed MOSFET device is as shownin FIG. 10, wherein source region 36 serves as a common source forrespective MOSFETs on opposing sides of the trench along thex-direction.

Operation of the MOSFET device will now be described with reference toFIG. 10. Upon application of a positive voltage to gate electrode 60, aninversion layer is created within base region 22 near top surface 24under gate oxide layer 50. The positive voltage applied to gateelectrode 60 attracts electrons to the interface between top surface 24of base region 22 and gate oxide layer 50. As electrons are attracted tothe interface between top surface 24 of base region 22 and gate oxidelayer 50, a current path is provided from source region 36 through tolayer 10 located beside the trench. This region of layer 10 beside thetrench may be characterized as a channel region. The device is thusturned on upon application of the positive voltage to gate electrode 60,wherein a current path is provided from source contact 70 through sourceregion 36, the inversion layer in base region 22, layer 10, and bufferlayer/substrate 15 to drain electrode 80. On the other hands if thevoltage applied to gate electrode is negative or zero, electrons are notattracted to the interface between top surface 24 of base region 22 andgate oxide layer 50. In absence of electrons at the interface, aninversion layer is not created and a current path thus does not exist inbase region 22 between source region 36 and layer 10. The MOS device isthus turned off. The region of layer 10 below the channel region may becharacterized as a blocking drift region.

As described previously with respect to FIG. 2, the p-type siliconcarbide layer 20 is epitaxially grown on bottom 13 and sidewall 16 oftrench 18. Since the crystal planes of the silicon carbide at bottom 13and sidewalls 16 within trench 18 are different, the rate of dopantincorporation during epitaxial regrowth can be about 10 times greater inthe vertical direction than in the horizontal direction. Accordingly,

p-type silicon carbide layer 20 epitaxially grown in a vertical ory-direction on bottom 13 of trench 18 has greater dopant concentrationthan p-type silicon carbide layer 20 epitaxially grown laterally in ahorizontal or x-direction from sidewall 16 of trench 18. Thus, thep-type dopant concentration in base region 22 of the MOSFET device shownin FIG. 10 is generally greater at bottom 13 of the trench, andgenerally lower near the interface between top surface 24 of base region22 and gate oxide layer 50. As a result of this anisotropic nature ofdopant incorporation during epitaxial regrowth of silicon carbide, thethreshold voltage at which electrons begin to accumulate at top surface24 of base region 22 is maintained low. That is, the anisotropic natureof the dopant incorporation is relied on to maintain low turn-onvoltage. The dopant concentration may however be controlled duringepitaxial regrowth of p-type silicon carbide layer 20 to be increased attop surface 24 of base region 22, so as to realize a higher turn-onvoltage if desired for a given application.

As noted above, because of the anisotropic dopant incorporation rateduring epitaxial regrowth, the dopant concentration of base region 22 ofFIG. 10 is relatively greater at the bottom of the trench. This helps toblock high voltage from the top of the device where the gate electrodecontrols the device. Incidentally, p⁺-type impurity region 14 asdescribed previously with reference to FIG. 1 also helps to block highvoltage from reaching the top of the device. However, the provision of ahigh dopant concentration in base region 22 at the bottom of the trenchand the use of impurity region 14 are not necessary to operate theMOSFET of FIG. 10. Different dopant profiles within base region 22 maybe realized if desired.

In a further alternative embodiment, the dopant profile of layer 10 inFIG. 10 may be non-uniformly graded in the vertical or y-direction. Forexample, layer 10 may be epitaxially grown so that the n-type dopantconcentration is lowest near a middle portion of layer 10 in thevertical direction, and so that the n-type dopant concentrationincreases approaching bottom and top surfaces 11 and 12 of layer 10.That is, dopant concentration of layer 10 would be lowest near thebottom of trench 18. Upon turning the MOSFET off, this dopant profilewould help to remove charges or carriers at the bottom of the trench asquickly as possible. The effectiveness of the depletion would thus beincreased at the bottom of the trench compared to portions of layer 10slightly higher above the bottom of the trench. This would help tomaintain the electric field at the oxide interface as low as possible. Alow electric field at the SiC oxide interface is important for the longterm stability of the device. High electric field may result ininjection of charge into the oxide and subsequent degradation of deviceperformance.

A further advantage of epitaxially regrowing base region 22 on layer 10within the trench, in contrast to ion implanting a base region into anexisting layer as in conventional DIMOS technology, is that ionimplantation damages an existing layer. In the case where the baseregion is conventionally formed by ion implantation, lower electronmobility is realized because of the inflicted damage. A higher qualitybase region is thus provided by epitaxially regrowth, resulting inimproved devices. This is also true with respect to source region 36.Higher dopant concentration and electron mobility may be realized byepitaxially regrowing base region 22 and source region 36.

A further aspect of the metallization process of FIG. 10 will now bedescribed. When forming contacts in general, high temperature annealingmay be carried out to improve the quality of the contact material.However, if the metal contact layers are too thick to begin with, themetal will have a tendency to flow at the edges during annealing,creating contacts with rough edges. To avoid rough edges, source contact70 in FIG. 10 may be formed in a two-step process. In this alternativeembodiment, source contact 70 is first formed as a thin layer of metalsuch as nickel, titanium, or titanium-tungsten by a sputtering orevaporation technique such as described previously. This thin layer isthen annealed to ensure that a good interface is made with theunderlying semiconductor material. A second layer of the correspondingmetal is thereafter formed on the annealed metal by a further sputteringor evaporation technique. Formation of drain electrode 80 may be carriedout in a similar manner.

Although the present invention has been described in detail, the scopeof the invention should not be limited by the corresponding descriptionand figures. For example, although silicon carbide epitaxial layers aredescribed, epitaxial layers made of other semiconductors such as galliumnitride or diamond may be used. Also, the concepts described aboveshould be applicable as well for the case wherein the conductivity typesof layer 10 and source region 36 are p-type, and the conductivity ofbase region 22 is n-type. Moreover, the alternative embodimentsincluding implanting impurity region 14, providing layer 10 with avertical dopant profile, and providing base region 22 as having lowerdopant concentration near surface 24 and greater dopant concentrationnear the bottom of the trench, should not be limited as to be usableseparately, but these alternative embodiments may be applied variouslytogether in combination. These various changes and modifications of thepreferred embodiments, as would become apparent to one of ordinaryskill, should be considered as within the spirit and scope of theinvention.

1. A method of manufacturing a MOSFET comprising: forming a trench in afirst layer, the first layer having opposite first and second surfaces,the trench extending into the first layer from the first surface;epitaxially growing a second layer and then a third layer within thetrench and over the first surface of the first layer; etching the firstand second layers using a mask to expose the first surface, to removethe third layer and part of the second layer within a middle area of thetrench, and to expose a surface of the second layer in a peripheral areaof the trench, to provide a first structure; forming a gate oxide layeron an entirety of the first structure; forming a gate electrode on thegate oxide layer over the surface of the second layer; etching the gateoxide layer within the middle area of the trench; forming a sourceelectrode within the middle area of the trench in contact with thesecond and third layers; and forming a drain electrode over the secondsurface of the first layer, wherein the first and third layers have aconductivity type opposite a conductivity type of the second layer. 2.The method of manufacturing a MOSFET of claim 1, further comprising:implanting an impurity region into a bottom of the trench before saidepitaxially growing a second layer, the impurity region having thesecond conductivity type and a dopant concentration greater than adopant concentration of the second layer.
 3. The method of manufacturinga MOSFET of claim 1, wherein the second layer is epitaxially grown ashaving a non-uniform dopant profile with a dopant concentration lowestnear the surface of the second layer.
 4. The method of manufacturing aMOSFET of claim 1, wherein the first layer is epitaxially grown ashaving a dopant profile graded in a vertical direction from the firstsurface to the second surface, with dopant concentration lowest near abottom of the trench and greater near the first and second surfaces. 5.The method of manufacturing a MOSFET of claim 1, wherein the firstconductivity type is n-type and the second conductivity type is p-type.6. The method of manufacturing a MOSFET of claim 1, wherein the first,second and third layers are silicon carbide.
 7. A method ofmanufacturing a MOSFET comprising: forming a trench in a first layer,the first layer having a first conductivity type and opposite first andsecond surfaces, the trench extending into the first layer from thefirst surface; epitaxially growing a second layer within the trench andon the first surface of the first layer, the second layer having asecond conductivity type opposite the first conductivity type;epitaxially growing a third layer on the second layer within the trenchand over the first surface of the first layer, the third layer havingthe first conductivity type; forming a first oxide layer on the thirdlayer within the trench and over the first surface of the first layer;etching the first oxide layer substantially vertically so that the firstoxide layer remains only over the trench as oxide spacers and so thatthe third layer is exposed between the oxide spacers, to provide a firststructure; etching the first structure using the oxide spacers as a maskto expose the first surface, to remove the third layer and part of thesecond layer between the oxide spacers, and to expose a surface of thesecond layer within the trench that is not between the oxide spacers, toprovide a second structure; forming a gate oxide layer on an entirety ofthe second structure; forming a gate electrode on the gate oxide layerover the surface of the second layer; etching the gate oxide layerbetween the oxide spacers; forming a source electrode between the oxidespacers in contact with the second and third layers; and forming a drainelectrode over the second surface of the first layer.
 8. The method ofmanufacturing a MOSFET of claim 7, further comprising: implanting animpurity region into a bottom of the trench before said epitaxiallygrowing a second layer, the impurity region having the secondconductivity type and a dopant concentration greater than a dopantconcentration of the second layer.
 9. The method of manufacturing aMOSFET of claim 7, wherein the second layer is epitaxially grown ashaving a non-uniform dopant profile with a dopant concentration lowestnear the surface of the second layer.
 10. The method of manufacturing aMOSFET of claim 7, wherein the first layer is epitaxially grown ashaving a dopant profile graded in a vertical direction from the firstsurface to the second surface, with a dopant concentration lowest near abottom of the trench and greater near the first and second surfaces. 11.The method of manufacturing a MOSFET of claim 7, wherein the first,second and third layers are silicon carbide.
 12. The method ofmanufacturing a MOSFET of claim 7, wherein the first conductivity typeis n-type and the second conductivity type is p-type.
 13. The method ofmanufacturing a MOSFET of claim 7, wherein said etching the gate oxidelayer comprises etching the gate oxide layer and portions of the oxidespacers using a reactive ion etching process and a chemical wet etchingprocess.